{"product_id":"co-pcb介质层激光钻孔系统","title":"CO₂ Laser Drilling System for PCB Dielectric Layers","description":"\u003cp\u003eThe CO₂ PCB dielectric laser drilling system produces high-speed micro-blind vias in resin, glass-fiber-reinforced dielectrics, and organic insulation layers used in HDI, package substrates, and multilayer circuit boards. Copper-surface preparation, vision registration, and automated panel handling can be integrated into a production cell.\u003c\/p\u003e\u003ch3\u003eTypical Applications\u003c\/h3\u003e\u003cul\u003e\u003cli\u003eMicro-blind vias in HDI boards, IC substrates, and multilayer PCBs\u003c\/li\u003e\u003cli\u003eSelective opening of organic insulation, resin, and composite dielectric layers\u003c\/li\u003e\u003cli\u003eHigh-volume hole arrays and stitched multi-zone panel processing\u003c\/li\u003e\u003c\/ul\u003e\u003ch3\u003eSystem Capabilities\u003c\/h3\u003e\u003cul\u003e\u003cli\u003eHigh-speed scanning, dual-head or multi-station options, and automatic registration\u003c\/li\u003e\u003cli\u003ePanel loading, unloading, flipping, zoned extraction, and inline inspection interfaces\u003c\/li\u003e\u003cli\u003eRecipe access control, barcode traceability, and MES connectivity\u003c\/li\u003e\u003c\/ul\u003e\u003cp\u003e\u003cstrong\u003eConfiguration note:\u003c\/strong\u003e CO₂, UV, or a combined process is selected by validating the copper layer, dielectric stack, hole geometry, residue, and throughput target.\u003c\/p\u003e","brand":"Aogeo Laser","offers":[{"title":"项目定制","offer_id":54023226196284,"sku":null,"price":0.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/2699\/2444\/files\/co2-pcb-dielectric-laser-drilling-system.png?v=1787741819","url":"https:\/\/aogeolaser.com\/products\/co2-laser-drilling-system-pcb-dielectric-layers","provider":"上海奥剑激光设备有限公司","version":"1.0","type":"link"}