{"product_id":"sic-ingot-laser-slicing-system","title":"SiC Ingot Laser Slicing System","description":"\u003ch2\u003eSiC Ingot Laser Slicing System\u003c\/h2\u003e\u003cp\u003eThe AOGEO SiC ingot laser slicing system serves the wafer-making stage of silicon carbide substrate manufacturing. Laser processing forms a separation layer at a defined depth inside the ingot, followed by controlled separation to obtain a wafer blank. The resulting blanks proceed to the specified grinding, polishing and inspection route.\u003c\/p\u003e\u003cul\u003e\u003cli\u003eApplications: Plan slicing around crystal type, orientation, off-angle and ingot condition. Coordinate internal processing, wafer removal and preparation of the remaining ingot for the next processing cycle.\u003c\/li\u003e\u003cli\u003eProcess inputs and outputs: Provide an SiC ingot with documented diameter, height, end-face condition and defect information. Outputs include separated wafer blanks, the remaining ingot and processing records for downstream material control.\u003c\/li\u003e\u003cli\u003eConfiguration discussion: Match the laser and optical arrangement to material absorption and internal focusing. Discuss depth control, scanning motion, ingot fixtures, separation support, wafer handling and the interface to subsequent grinding equipment.\u003c\/li\u003e\u003cli\u003eQuality and acceptance: Measure blank thickness distribution, bow, cracks, surface condition and subsurface damage. Review material utilization together with the required finishing allowance, using agreed sampling, inspection methods and before-and-after records.\u003c\/li\u003e\u003cli\u003eRFQ information: Supply crystal type and off-angle, ingot dimensions, end-face images, target wafer thickness, the planned finishing route and representative samples. Include acceptance items, handling constraints, cleanliness expectations and traceability requirements.\u003c\/li\u003e\u003c\/ul\u003e\u003cp\u003eExplore \u003ca href=\"\/pages\/laser-solutions-semiconductor\"\u003esemiconductor laser solutions\u003c\/a\u003e or \u003ca href=\"\/pages\/request-a-quote\"\u003esubmit your ingot samples and process requirements\u003c\/a\u003e.\u003c\/p\u003e","brand":"Aogeo Laser","offers":[{"title":"Default Title","offer_id":67650112323900,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/2699\/2444\/files\/sic-ingot-laser-slicing-clean-v2.png?v=1791626859","url":"https:\/\/aogeolaser.com\/products\/sic-ingot-laser-slicing-system","provider":"上海奥剑激光设备有限公司","version":"1.0","type":"link"}