{"product_id":"半导体引线框架精密激光切割系统","title":"半导体引线框架精密激光切割系统","description":"\u003ch2\u003e半导体引线框架精密激光切割系统\u003c\/h2\u003e\u003cp\u003e面向铜合金、铁镍合金和薄金属带材的引线框架轮廓切割、开槽、去连筋与小批量柔性制造，适合高精度封装零件和多品种快速换型。\u003c\/p\u003e\u003ch3\u003e典型应用\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e引线框架精密轮廓与微孔加工\u003c\/li\u003e\n\u003cli\u003e薄铜合金和可伐合金切割\u003c\/li\u003e\n\u003cli\u003e封装载板金属件去连筋与修边\u003c\/li\u003e\n\u003cli\u003e研发样件和中小批量柔性生产\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003e系统配置\u003c\/h3\u003e\u003cp\u003e可配置精密光纤、绿光或UV激光器，高精度直线电机平台、显微视觉、卷料或片料夹具、微型除尘和在线检测。工艺需根据材料厚度、毛刺、切缝和热影响要求验证。\u003c\/p\u003e\u003cp\u003e\u003ca href=\"\/zh\/pages\/laser-cutting-process\"\u003e了解激光切割工艺\u003c\/a\u003e · \u003ca href=\"\/zh\/pages\/request-a-quote\"\u003e咨询精密切割配置\u003c\/a\u003e\u003c\/p\u003e\u003cp\u003e\u003ca href=\"\/zh\/pages\/laser-solutions-semiconductor\"\u003e返回半导体激光解决方案\u003c\/a\u003e\u003c\/p\u003e","brand":"Aogeo Laser","offers":[{"title":"Default Title","offer_id":54020425843004,"sku":null,"price":0.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/2699\/2444\/files\/semiconductor-leadframe-laser-cutting.png?v=1787639257","url":"https:\/\/aogeolaser.com\/zh\/products\/%e5%8d%8a%e5%af%bc%e4%bd%93%e5%bc%95%e7%ba%bf%e6%a1%86%e6%9e%b6%e7%b2%be%e5%af%86%e6%bf%80%e5%85%89%e5%88%87%e5%89%b2%e7%b3%bb%e7%bb%9f","provider":"上海奥剑激光设备有限公司","version":"1.0","type":"link"}