{"product_id":"晶圆激光划片与微细切割系统","title":"晶圆激光划片与微细切割系统","description":"\u003ch2\u003e晶圆激光划片与微细切割系统\u003c\/h2\u003e\u003cp\u003e用于硅、碳化硅、砷化镓、蓝宝石和薄膜材料的精密划线、开槽与微细切割。通过UV或超快激光和高动态精密平台，控制崩边、裂纹、热影响区与切缝宽度。\u003c\/p\u003e\u003ch3\u003e典型应用\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e硅晶圆和碳化硅晶圆划片\u003c\/li\u003e\n\u003cli\u003e蓝宝石、GaAs和薄膜基板微切割\u003c\/li\u003e\n\u003cli\u003e芯片分割前的精密开槽\u003c\/li\u003e\n\u003cli\u003e晶圆级封装和薄型基板轮廓加工\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003e系统配置\u003c\/h3\u003e\u003cp\u003e可配置UV纳秒、皮秒或飞秒激光器，真空吸附晶圆台、自动对焦、显微视觉、对准标记识别、除尘和洁净室兼容结构。需根据晶圆直径、厚度、材料和崩边指标确定工艺。\u003c\/p\u003e\u003cp\u003e\u003ca href=\"\/zh\/pages\/laser-cutting-process\"\u003e了解激光切割工艺\u003c\/a\u003e · \u003ca href=\"\/zh\/pages\/request-a-quote\"\u003e咨询专用光源与平台配置\u003c\/a\u003e\u003c\/p\u003e\u003cp\u003e\u003ca href=\"\/zh\/pages\/laser-solutions-semiconductor\"\u003e返回半导体激光解决方案\u003c\/a\u003e\u003c\/p\u003e","brand":"Aogeo Laser","offers":[{"title":"Default Title","offer_id":54020425875772,"sku":null,"price":0.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/2699\/2444\/files\/wafer-laser-dicing-scribing.png?v=1787639229","url":"https:\/\/aogeolaser.com\/zh\/products\/%e6%99%b6%e5%9c%86%e6%bf%80%e5%85%89%e5%88%92%e7%89%87%e4%b8%8e%e5%be%ae%e7%bb%86%e5%88%87%e5%89%b2%e7%b3%bb%e7%bb%9f","provider":"上海奥剑激光设备有限公司","version":"1.0","type":"link"}