AOGEO / TECHNICAL RESOURCES
Build evidence before moving to production.
Plan material trials, define acceptance criteria and evaluate process results before committing to a production system.
THE RESOURCE LIBRARY
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Plan GaN LED laser lift-off around growth-substrate release, supported device layers, residue and damage checks, and matched optical and electrical tests through the transfer flow.
Read the guideValidate electrical feedback, trim paths, stop rules and post-process stability for wafer laser trimming. Distinguish reaching a resistance target from acceptable device function.
Read the guidePlan thin-wafer laser debonding around the optical path, release layer and support transfer. Define checks for residue, warpage, cracks and device function before equipment acceptance.
Read the guideCombine four-wire resistance, load testing, interface sections and application stresses to validate power-module laser welds with controlled conditions and traceable evidence.
Read the guideValidate target-layer removal, residue, protected layers and device function. Turn sample results into a defined acceptance plan for selective laser thin-film removal.
Read the guideValidate alumina and AlN ceramic cutting using the actual thickness and metallization stack, final separation, edge inspection and thermal or insulation evidence.
Read the guideValidate leadframe burrs, recast, distortion and dimensions with defined datums, controlled support, complementary measurements and downstream assembly evidence.
Read the guideSeparate source capture, airborne particles, workpiece contamination and facility exhaust interfaces. Define operating states, ownership and recovery evidence before acceptance.
Read the guideDefine separate acceptance evidence for weld structure, whole-package leakage and device function, with a practical test matrix, calibration checks and validation RFQ inputs.
Read the guideBuild a measurable wafer dicing acceptance plan for front and back chipping, microcracks, particles and residues. Combine controlled sampling with microscopy, die strength and device-func...
Read the guideSeparate successful decoding, DPM symbol quality, payload correctness and MES identity binding, then validate the complete traceability path under production conditions.
Read the guidePlan semiconductor laser equipment acceptance around controlled samples, measurement methods, complete-cycle timing, interfaces, exception recovery and an evidence-based handover.
Read the guideTAKE THE NEXT STEP
Share the material, part drawing, process target and acceptance criteria. Build the next evaluation around your actual requirements.
