Choose by material and hole task
| Route | Discuss and test |
|---|
| Ultrafast micro-hole drilling | Material response, hole geometry, edge condition and inspection method. |
| UV precision drilling | Layer structure, positioning, residue and protected features. |
| QCW metal drilling | Hole depth, entrance geometry, recast and cross-section acceptance. |
| PCB/FPC microvias | Copper and dielectric stack, target layer, residue and downstream metallization; compare UV and CO₂ routes. |
| Roll-to-roll perforation | Foil or coated stack, web handling, hole pattern and functional checks. |
Send a drawing and representative samples
Include material grade or layer stack, thickness, hole diameter and depth, entry angle, blind or through-hole requirements, pattern and locating datums. Specify acceptable taper, burr, recast, cracks, residue, target cycle and the inspection or cross-section method. These are project inputs and test criteria, not universal equipment limits.
For blind holes, identify the target layer and material that must remain intact. For through-holes, define entry and exit inspection, backing or support, and residue handling. Coated or multilayer samples should represent production condition. Include rejected-part examples where possible so the test matrix addresses the actual failure mode, rather than only the appearance of a single hole.
Common selection questions
Is laser power enough to select a machine? No. Wavelength, pulse format, optics, motion, material and inspection requirements must be considered together.
How is a route confirmed? Agree on samples, a test matrix and measurable acceptance criteria before finalizing configuration.
Read the laser drilling process guide or submit drilling samples for validation.
