Maskless Laser Direct-Write Photolithography System

Maskless Laser Direct-Write Photolithography System

The AOGEO maskless laser direct-write photolithography system exposes digital patterns onto photoresist-coated wafers or substrates. It defines patterns for semiconductor, MEMS and sensor processing through layout import, alignment and exposure control. The exposed workpiece then follows the specified development and pattern-transfer sequence.

• Applications: Digitally expose device regions, test structures and interconnect patterns using a compatible positive- or negative-resist process. Support design iteration and different layouts, with developed resist patterns feeding the customer's specified etching, deposition or lift-off operations.
• Process inputs and outputs: Inputs are resist-coated, preprocessed substrates, digital layouts, alignment marks and resist-process information. Outputs include exposed workpieces and exposure records. Inspect the resist pattern after development using the agreed measurement methods.
• Configuration discussion: Match the source and exposure approach to resist sensitivity. Coordinate data preparation, exposure dose, scanning and stitching, focus and height management, stage motion, alignment and clean handling around the substrate and layout.
• Quality and acceptance: Establish checks for critical dimensions, overlay, stitching, dose uniformity, resist residue and sidewall condition. Evaluate results together with coating, baking and development conditions, while preserving the relevant layout and recipe versions.
• RFQ information: Provide substrate dimensions and surface structures, resist designation and thickness, layout format, critical features and alignment requirements. Include the exposure-development sequence, sample substrates, inspection methods, automation needs and production-data requirements.

Explore semiconductor laser application routes or submit your direct-write exposure requirements.