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Industrial laser system
Thin-Wafer Laser Debonding LDB System
The AOGEO thin-wafer laser debonding system releases temporary carriers after wafer thinning or the specified backside operations. Laser energy passes through a compatible transparent carrier and acts on the release l...
✓Process review
✓Sample testing
✓Automation configuration
Process and acceptance details
Thin-Wafer Laser Debonding LDB System
The AOGEO thin-wafer laser debonding system releases temporary carriers after wafer thinning or the specified backside operations. Laser energy passes through a compatible transparent carrier and acts on the release layer. Controlled separation and supported transfer then prepare the thin wafer for the planned cleaning, inspection and packaging steps.
- Applications: Integrate carrier release into thin-wafer and advanced-packaging routes that use temporary bonding for mechanical support. Position the operation according to the optical and thermal behavior of the carrier, adhesive and release-layer stack.
- Process inputs and outputs: Inputs are processed wafers temporarily bonded to documented carrier and adhesive structures. Outputs include released wafers transferred to the agreed support, separated carriers and records linking the debonding operation to each wafer.
- Configuration discussion: Match carrier transmission, release-layer absorption, laser delivery and scan overlap. Define alignment, focus management, wafer support, separation motion and vacuum handling, together with interfaces for residue cleaning and carrier handling.
- Quality and acceptance: Inspect release completeness, adhesive residue, particles, wafer cracks, bow and device-surface condition. Establish separate checkpoints for debonding and supported transfer, and compare electrical behavior and cleaning results under the agreed measurement plan.
- RFQ information: Provide wafer and carrier dimensions, the complete temporary-bonding stack, adhesive and release-layer information, wafer thickness and backside structures. Include thermal limits, the transfer-support plan, downstream requirements and representative bonded samples.
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DEVICE PROFILE
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ENGINEERING SELECTION
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Process & quality targets
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Cycle time & output
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Automation & interfaces
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FAQ
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View service & supportWhat information is needed before equipment selection?
Share part drawings or photos, material and thickness, process location, quality standard, target cycle time, and automation or interface requirements.
Is the configuration shown in the video final?
Videos illustrate operation and process direction. Laser source, optics, motion, tooling, vision and safety are configured for the actual part and project targets.
Do you support sample testing and process validation?
Yes. Submit materials, drawings and acceptance criteria; after the test scope is agreed, results can guide equipment selection.
How is the delivery scope defined?
The agreed project documents define the scope, which may include equipment, process validation, tooling, automation, training and service support.
Semiconductor technical guides
Selection and acceptance guides for this system
Use these guides to prepare samples, compare the technical route and define acceptance criteria before confirming the configuration.
Process validation guides
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Thin-Wafer Laser Debonding: Carrier Release and Validation
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