Ultrafast laser · Laser cutting
Wafer Laser Dicing & Micromachining System
For precision scribing, grooving and micro-cutting of silicon, silicon carbide, gallium arsenide, sapphire and thin-film materials. UV or ultrafast lasers combined with a high-dynamic precision stage control chipping,...
Laser cuttingPrecision micromachiningUltrafast laserEnclosed workstation
✓Process review
✓Sample testing
✓Automation configuration
DEVICE PROFILE
Equipment capability overview
Review process, material and automation fit at a glance. Final configuration is confirmed against your part, cycle time and quality targets.
Core processes
Laser cuttingPrecision micromachining
Materials
Semiconductors & wafersGlassCeramics & sapphire
Industries
Semiconductor
System format
- Laser type
- Ultrafast laser
- Equipment format
- Enclosed workstation
PROCESS & APPLICATION
Move from equipment to a complete solution
Evaluate the machine in the context of process, industry and material requirements to compare routes and plan validation.
01 · PROCESS
Laser cutting
Review process principles, critical variables and compatible equipment.
View process page ↗ 02 · INDUSTRYSemiconductor
Explore typical parts, quality priorities and production-line concepts.
View industry solution ↗ 03 · PRODUCT FAMILYLaser Micromachining Systems
Compare related equipment and automation formats.
View related equipment ↗ 04 · VALIDATIONSample testing & process validation
Validate the process window using real materials and quality targets.
View validation process ↗
ENGINEERING SELECTION
Engineering selection starts with four inputs
A model number is only a starting point. Define the part, target, cycle time and integration conditions to build a verifiable configuration.
Part & material
Provide material, dimensions, thickness, surface condition and fixturing requirements.
Process & quality targets
Define the required result, precision, appearance and consistency criteria.
Cycle time & output
Provide target cycle time, shifts, loading method and changeover frequency to size the system correctly.
Automation & interfaces
Evaluate vision, traceability, robotics, material handling and production-line communication requirements.
FAQ
Questions before starting a project
Confirm the project boundary before sample testing and engineering configuration to reduce selection cycles.
View service & supportWhat information is needed before equipment selection?
Share part drawings or photos, material and thickness, process location, quality standard, target cycle time, and automation or interface requirements.
Is the configuration shown in the video final?
Videos illustrate operation and process direction. Laser source, optics, motion, tooling, vision and safety are configured for the actual part and project targets.
Do you support sample testing and process validation?
Yes. Submit materials, drawings and acceptance criteria; after the test scope is agreed, results can guide equipment selection.
How is the delivery scope defined?
The agreed project documents define the scope, which may include equipment, process validation, tooling, automation, training and service support.
Semiconductor technical guides
Selection and acceptance guides for this system
Use these guides to prepare samples, compare the technical route and define acceptance criteria before confirming the configuration.
Technology comparison guides
Explore semiconductor laser solutions
Laser Dicing vs Blade Dicing: How to Choose a Wafer Singulation Route
Compare blade dicing, laser ablation and internal laser modification by wafer stack, street design, damage risks and total process flow. Use a matc...
Read the guide Process validation guidesWafer Dicing Defects: Chipping, Microcracks and Particle Validation
Build a measurable wafer dicing acceptance plan for front and back chipping, microcracks, particles and residues. Combine controlled sampling with ...
Read the guide Process validation guidesAlumina and AlN Ceramic Substrates: Laser Cutting and Validation
Validate alumina and AlN ceramic cutting using the actual thickness and metallization stack, final separation, edge inspection and thermal or insul...
Read the guide
RELATED EQUIPMENT
Related equipment
Compare equipment formats and application strengths across the Laser Micromachining Systems range.
START YOUR PROJECT
Turn your part requirements into a validated laser process
Share your material, dimensions, quality targets and cycle time. Our engineering team will recommend the next validation step.