LASER WELDING EQUIPMENT
All Laser Welding Machines
11 machines. Match the laser source, power, optics, and automation to material, joint, penetration, heat input, and cycle time.
View equipment series ↗
UV laser · Laser marking & coding
Semiconductor UV Laser Marking & Traceability System
Provides permanent, low-heat-impact identification for IC packages, power modules, ceramic devices, wafers and precision electronic components. It produces Data Matrix codes, QR codes, batch numbers and characters, wi...
Equipment capability overview
Review process, material and automation fit at a glance. Final configuration is confirmed against your part, cycle time and quality targets.
Core processes
Materials
Industries
System format
- Laser type
- UV laser
- Equipment format
- Vision-guided automation
Move from equipment to a complete solution
Evaluate the machine in the context of process, industry and material requirements to compare routes and plan validation.
Laser marking & coding
Review process principles, critical variables and compatible equipment.
View process page ↗ 02 · INDUSTRYSemiconductor
Explore typical parts, quality priorities and production-line concepts.
View industry solution ↗ 04 · VALIDATIONSample testing & process validation
Validate the process window using real materials and quality targets.
View validation process ↗Engineering selection starts with four inputs
A model number is only a starting point. Define the part, target, cycle time and integration conditions to build a verifiable configuration.
Part & material
Provide material, dimensions, thickness, surface condition and fixturing requirements.
Process & quality targets
Define the required result, precision, appearance and consistency criteria.
Cycle time & output
Provide target cycle time, shifts, loading method and changeover frequency to size the system correctly.
Automation & interfaces
Evaluate vision, traceability, robotics, material handling and production-line communication requirements.
Questions before starting a project
Confirm the project boundary before sample testing and engineering configuration to reduce selection cycles.
View service & supportWhat information is needed before equipment selection?
Share part drawings or photos, material and thickness, process location, quality standard, target cycle time, and automation or interface requirements.
Is the configuration shown in the video final?
Videos illustrate operation and process direction. Laser source, optics, motion, tooling, vision and safety are configured for the actual part and project targets.
Do you support sample testing and process validation?
Yes. Submit materials, drawings and acceptance criteria; after the test scope is agreed, results can guide equipment selection.
How is the delivery scope defined?
The agreed project documents define the scope, which may include equipment, process validation, tooling, automation, training and service support.
Semiconductor technical guides
Selection and acceptance guides for this system
Semiconductor Laser Marking: Material Selection, Mark Depth and Damage Risks
Choose a semiconductor marking route by the actual surface, package stack, allowable material change and code requirements. Compare candidate wavel...
Read the guide Process validation guidesSemiconductor Data Matrix Marking: Code Quality and Traceability Acceptance
Separate successful decoding, DPM symbol quality, payload correctness and MES identity binding, then validate the complete traceability path under ...
Read the guide Process validation guidesSemiconductor Laser System FAT and SAT: Build an Acceptance Matrix
Plan semiconductor laser equipment acceptance around controlled samples, measurement methods, complete-cycle timing, interfaces, exception recovery...
Read the guideTurn your part requirements into a validated laser process
Share your material, dimensions, quality targets and cycle time. Our engineering team will recommend the next validation step.